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Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.

Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

6,66 €
561487

TG-G3.0-01

8716309083133

Shipping 2-3 b.d.

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Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Performance
Operating temperature (T-T) -50 - 240 °C
Thermal conductivity 4.5 W/m·K
Design
Product colour Grey
Weight & dimensions
Weight 3 g
Package weight 33 g
Height 15 mm
Width 120 mm
Depth 180 mm
Package height 15 mm
Package width 120 mm
Package depth 180 mm
Technical details
Compliance certificates RoHS
Other features
Thermal resistance 0.205 °C/W