The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.
Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
11.35 €
561487 TG-G3.0-01
8716309083133
Shipping 3-7 b.d.
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All about the product
Thermal compund (grease) for heatsinksHelps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Performance | |
| Operating temperature (T-T) | -50 - 240 °C |
| Thermal conductivity | 4.5 W/m·K |
Design | |
| Product colour | Grey |
Weight & dimensions | |
| Weight | 3 g |
| Package weight | 33 g |
| Height | 15 mm |
| Width | 120 mm |
| Depth | 180 mm |
| Package height | 15 mm |
| Package width | 120 mm |
| Package depth | 180 mm |
Technical details | |
| Compliance certificates | RoHS |
Other features | |
| Thermal resistance | 0.205 °C/W |
