Thermal Grizzly Hydronaut Pro thermal paste – 2 g

“Hydronaut Pro” – an optimized composition thermal paste without silicone, suitable for use in both industrial systems and high-performance computer systems. Due to its excellent thermal conductivity, it is particularly suitable for use with large surface area radiators, such as gaming computers with special water cooling. “Hydronaut Pro” combines high performance with an attractive price-to-quality ratio and is also designed for overclocking applications.

Features

• Suitable for industrial use
• Excellent thermal conductivity
• Silicone-free
• Electrically non-conductive
• No hardening

Silicone-free, for industrial systems

“Hydronaut Pro” thermal paste has a carrier structure without silicone. Many thermal pastes use silicone-based oils (e.g., siloxanes) as carrier fluids or as part of the matrix. Under thermal stress, especially with fluctuating temperatures, changes in the paste can occur, such as leakage and displacement from the contact zone. Repeated temperature changes and micro-movements between the processor IHS and the cooler base can enhance this effect. The mechanical displacement of the paste from the contact surface is called the pumping effect. Under normal computer use, this is usually not a critical phenomenon. However, in industrial applications, leakage of silicone-based oils can be undesirable, especially if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can cause material swelling or changes in properties. The product meets RoHS requirements and is designed as an easy-to-use thermal medium for demanding users.