Qoltec 51647 heat sink compound 3.17 W/m·K 5 g
Qoltec 51647 heat sink compound 3.17 W/m·K 5 g

The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.

Qoltec 51647 heat sink compound 3.17 W/m·K 5 g

12.88
4131571

51647

5901878516479

Shipping 9-13 b.d.

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All about the product

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.
Performance
Quantity per pack 1 pc(s)
Thermal conductivity 3.17 W/m·K
Design
Product colour Silver
Weight & dimensions
Weight 5 g
Other features
Thermal resistance 0.067 °C/W