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Qoltec 51644 heat sink compound 3.05 W/m·K 100 g
22.83 €
3552069 51644
5901878516448
Shipping 9-13 b.d.
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All about the product
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.Performance | |
| Quantity per pack | 1 pc(s) |
| Thermal conductivity | 3.05 W/m·K |
Weight & dimensions | |
| Weight | 100 g |
Other features | |
| Thermal resistance | 0.073 °C/W |
