Qoltec 51653 heat sink compound 4.63 W/m·K 30 g
Qoltec 51653 heat sink compound 4.63 W/m·K 30 g

The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.

Qoltec 51653 heat sink compound 4.63 W/m·K 30 g

18.93
3531856

51653

5901878516530

Shipping 9-13 b.d.

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All about the product

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.
Performance
Thermal conductivity 4.63 W/m·K
Design
Product colour Grey
Weight & dimensions
Weight 30 g
Package weight 440 g
Other features
Thermal resistance 0.0087 °C/W