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Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
8.56 €
665486 XZ019
4044953501074, 4044953106941
Shipping 2-3 b.d.
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All about the product
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.Performance | |
| Operating temperature (T-T) | -30 - 280 °C |
| Quantity per pack | 1 pc(s) |
| Thermal conductivity | 5.15 W/m·K |
Design | |
| Certification | CE |
| Product colour | Black, Red, White |
Weight & dimensions | |
| Weight | 3 g |
| Package height | 10 mm |
| Package width | 120 mm |
| Package depth | 20 mm |
Technical details | |
| Compliance certificates | RoHS |
Other features | |
| Thermal resistance | 0.201 °C/W |
