Smartphones are now coming with artificial intelligence: who is already selling, who is advertising on July 22 - and why Apple gave in - Smartphones are now coming with artificial intelligence: who is already selling, who is advertising on July 22 - and why Apple gave in
-
Intel has entered handheld consoles - AMD is no longer the only one -
RAM-ageddon 2026: Why Your New Phone and Console Just Got €100 More Expensive -
Apple Orders 10 Million Foldable iPhone Ultra Units — Reports -
€329, 5200 mAh and Software Support Until 2032 — What the Nothing Phone (4b) Really Offers
The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.
Thermaltake TG-30 heat sink compound Thermal paste 4.5 W/m·K
19,00 €
2247699 CL-O023-GROSGM-A
4713227525831, 0841163075845
This product is no longer in stock
You are interested in this product?
High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
All-In-One Application Kit
This thermal compound application kit includes a set of easily-applied tools for immediate use.
Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
Performance | |
| Type | Thermal paste |
| Quantity per pack | 1 pc(s) |
| Thermal conductivity | 4.5 W/m·K |
Design | |
| Product colour | Black |