RAM-ageddon 2026: Why Your New Phone and Console Just Got €100 More Expensive Loading...
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Сумма лизинга: 2009.00 €
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LHV | |
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The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.
1940655 KF556C40BBK4-128
0740617335194
This product is no longer in stock
Availability date:
Features | |
| ECC | No |
| Module configuration | 4096M x 64 |
| Internal memory type | DDR5 |
| Lead plating | Gold |
| CAS latency | 40 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory voltage | 1.25 V |
| SPD profile | Yes |
| Cooling type | Heatsink |
| Memory form factor | 288-pin DIMM |
| Memory channels | Quad-channel |
| Memory ranking | 2 |
| Component for | PC |
| Internal memory | 128 GB |
| Memory layout (modules x size) | 4 x 32 GB |
| Product colour | Black |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| SPD speed | 4800 MHz |
| SPD latency | 39 |
| SPD voltage | 1.1 V |
| JEDEC standard | Yes |
| Programming power voltage (VPP) | 1.8 V |
| Buffered memory type | Unregistered (unbuffered) |
| On-Die ECC | Yes |
| Memory data transfer rate | 5600 MT/s |
Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
| Weight | 138.36 g |
| Width | 6.62 mm |
| Depth | 133.3 mm |
| Height | 34.9 mm |
Packaging data | |
| Package weight | 201.99 g |
| Package type | Blister |
| Package width | 95.2 mm |
| Package depth | 25.4 mm |
| Package height | 171.4 mm |
Other features | |
| Country of origin | China, Taiwan |
Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.23 kg |
| Products per master (outer) case | 10 pc(s) |