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Home page > Computers & Peripherals>PC Components>Cooler>Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g

The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.

Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g

8,49 €
665486

XZ019

4044953501074, 4044953106941

Shipping 2-3 b.d.

Quantity

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Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
Performance
Operating temperature (T-T) -30 - 280 °C
Quantity per pack 1 pc(s)
Thermal conductivity 5.15 W/m·K
Design
Certification CE
Product colour Black, Red, White
Weight & dimensions
Weight 3 g
Package height 10 mm
Package width 120 mm
Package depth 20 mm
Technical details
Compliance certificates RoHS
Other features
Thermal resistance 0.201 °C/W