Blow Ag Termopasty Printed circuit board etching agent B327 500g
Blow Ag Termopasty Printed circuit board etching agent B327 500g – 2
Blow Ag Termopasty Printed circuit board etching agent B327 500g – 3
Blow Ag Termopasty Printed circuit board etching agent B327 500g – 4
Blow Ag Termopasty Printed circuit board etching agent B327 500g – 5
Blow Ag Termopasty Printed circuit board etching agent B327 500g
Blow Ag Termopasty Printed circuit board etching agent B327 500g
Blow Ag Termopasty Printed circuit board etching agent B327 500g
Blow Ag Termopasty Printed circuit board etching agent B327 500g
Blow Ag Termopasty Printed circuit board etching agent B327 500g

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Blow Ag Termopasty Printed circuit board etching agent B327 500g

19.00
3553579

2431#

5901764329343

Piegāde 8-12 d.d.

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Etching agent for printed circuit board manufacturing. It is an alternative to ferric chloride. It dissolves very quickly and does not crystallize from solution. The boards are etched evenly, ensuring sharp contours and reducing cutting.

Application: Dissolve the product in 0.5 l of water at a temperature of approximately 50 ° C. Etch at a temperature of 40 ° C (maximum 50 ° C). The movement of the water ensures faster etching. The dissolved product must not be stored in hermetically sealed containers, as excessive pressure may build up and cause an explosion.