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Blow HP thermal paste 100 g HP
2166947 91-414#
5901764327219
Piegāde 8-14 d.d.
Viss par produktu
AG SILICONE THERMAL PASTE HP 100g
HP THERMAL CONDUCTIVE PASTE required for proper operation of all types of temperature sensors. Protects against exposure to weather, protects against punctures. It has very good chemical resistance to oxidation, water solutions, acids, salt bases, sulfur dioxide and ammonia. It has a wide operating temperature range.
Application:
Modules with a high thermal conductivity coefficient
Cooling units on backplates or frames
Storage and high-speed drives
Engine control systems in the automotive industry
Hard drives and DVD drives
Power converters
High power LEDs
Network devices
Household appliances, electronic and electrical components
Heat transfer from a heat pipe condenser to a heat exchanger in a vacuum solar collector
Specification:
- White color
- Thermal conductivity: 1.5W/sq.m
- Thermal resistance: 0.0227 °C in2/W
- Specific density: 2.1 g/cm3
- Pairing: 0.001
- Leakage: 0.05
- Dialect constant: 5.0
- Viscosity: does not flow
- Thixotropic index: 380+/-10
- Temperature resistance: -50~340 °C
- Operating temperature: -30~300 °C
- Volume: 100g
